World Leading and NXP Singapore Joint Venture Wafer Fab Groundbreaking, Expected to Commence Production in 2027

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On December 4, Jinshi Data reported that World Advanced released a press release stating that World Advanced and NXP (NXPI.O) held a groundbreaking ceremony for the 12-inch wafer fab in VSMC, a joint venture in Singapore. The first 12-inch wafer fab of VSMC is expected to be mass-produced in 2027, with a monthly output of 55,000 pieces by 2029, and an estimated creation of about 1,500 jobs. After the first 12-inch fab is mass-produced, World Advanced and NXP will evaluate the construction of a second wafer fab. World Advanced and NXP announced the establishment of VSMC joint venture in Singapore on June 5 this year to build a 12-inch wafer fab, with a total investment of about US$7.8 billion.

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