金十数据3月31日讯,日本准备向芯片初创公司Rapidus提供高达8025亿日元(合54亿美元)的额外援助,反映出日本政府确保半导体供应的决心日益增强。日本经济产业省周一表示,已批准最多6755亿日元的前端加工和1270亿日元的后端加工(包括芯片封装和测试)额外支持,以帮助Rapidus从零开始批量生产先进半导体。到目前为止,日本政府为这家羽翼未丰的合同芯片制造商拨出的纳税人资金总额将达到1.72万亿日元。
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