Four chip tests for AI to autos: Teradyne’s India summit showcase

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Teradyne (NASDAQ: TER) will showcase its semiconductor test solutions at the 2026 IESA Vision Summit in Bengaluru, India, focusing on innovations for AI and automotive applications. The company will feature four flagship test platforms: UltraFLEX, UltraFLEXplus, J750, and ETS, designed to enhance product quality and reduce market time for semiconductor manufacturers. Additionally, Teradyne will contribute to the summit’s thought leadership program with a keynote speech and participation in a panel discussion.

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