On July 4th, Jinshi data, according to industry sources, Samsung Electronics' Device Solutions (DS) department responsible for the semiconductor business underwent a reorganization, establishing a new HBM research and development group. Sun Yongzhu, Vice President of Samsung Electronics and a high-performance DRAM design expert, was appointed as the head of the research and development group, leading the team to focus on the development of HBM3, HBM3E, and the next-generation HBM4 technology. In addition, Samsung Electronics also reorganized the Advanced Packaging (AVP) team and the Equipment Technology Experiment Institute to enhance overall technological competitiveness.
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Samsung Electronics is reportedly reorganizing its new HBM chip development team
On July 4th, Jinshi data, according to industry sources, Samsung Electronics' Device Solutions (DS) department responsible for the semiconductor business underwent a reorganization, establishing a new HBM research and development group. Sun Yongzhu, Vice President of Samsung Electronics and a high-performance DRAM design expert, was appointed as the head of the research and development group, leading the team to focus on the development of HBM3, HBM3E, and the next-generation HBM4 technology. In addition, Samsung Electronics also reorganized the Advanced Packaging (AVP) team and the Equipment Technology Experiment Institute to enhance overall technological competitiveness.