Jin10 Data, May 28 - With a series of policies being introduced intensively and active responses from market participants, the bond market's "technology board" is accelerating its deployment. According to Wind data, since the launch of technology innovation bonds on May 9, a total of 137 technology innovation bonds have been issued as of May 27, with a total issuance amount of 322.91 billion yuan. Experts indicate that the current multi-tiered bond product system is becoming more complete, which will better match the financing needs of technology companies at different life cycle stages and guide funds toward the technology innovation sector.
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The "technology sector" in the bond market is accelerating its layout, guiding financial resources to gather towards the "new".
Jin10 Data, May 28 - With a series of policies being introduced intensively and active responses from market participants, the bond market's "technology board" is accelerating its deployment. According to Wind data, since the launch of technology innovation bonds on May 9, a total of 137 technology innovation bonds have been issued as of May 27, with a total issuance amount of 322.91 billion yuan. Experts indicate that the current multi-tiered bond product system is becoming more complete, which will better match the financing needs of technology companies at different life cycle stages and guide funds toward the technology innovation sector.